Microstructural investigations and mechanical properties of pure lead-free (Sn–3.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu) solder alloy

  • Manoj Kumar Pal Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc
  • Gréta Gergely Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc
  • Dániel Koncz Horváth Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc
  • Zoltán Gácsi Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc
Keywords: Lead-free solder, Sn–Ag–Cu alloys, Microstructure, Mechanical properties.

Abstract

The Lead-free solders (SAC) with low Ag content have been identified as crucial solder to replace the traditional Sn–Pb solder. The main discussion was presented in two major area of microstructural investigation and mechanical properties of SAC305 and SAC405. Composition and microstructure of SAC solder alloys were investigated by an optical microscope and SEM (Scanning Electron Microscopy). Mechanical properties such as tensile tests and hardness test of the lead-free solder alloys have been tested in this research. Different Ag content and constant Cu content of lead-free solder has been considered in this investigation and compare the mechanical properties of SAC305 and SAC405 solders. From this investigation, tensile strength and hardness have been increased with increased of Ag content.

Author Biography

Manoj Kumar Pal, Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc
Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc, Hungary

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Published
2018-04-02
Section
Technical papers