M. K. Pal, G. Gergely, D. K. Horváth, and Z. Gácsi, “Microstructural investigations and mechanical properties of pure lead-free (Sn-3.0Ag-0.5Cu and Sn-4.0Ag-0.5Cu) solder alloy”, Metall Mater Eng, vol. 24, no. 1, pp. 27–36, Apr. 2018.