[1]
A. A. Baba, O. O. Olumodeji, F. A. Adekola, M. Lawa, and A. S. Aremu, “Quantitative Leaching of a Spent Cell Phone Printed Circuit Board by Hydrochloric acid”, Metall Mater Eng, vol. 20, no. 2, pp. 119–130, Jul. 2014.