PAL, M. K.; GERGELY, G.; HORVÁTH, D. K.; GÁCSI, Z. Microstructural investigations and mechanical properties of pure lead-free (Sn-3.0Ag-0.5Cu and Sn-4.0Ag-0.5Cu) solder alloy. Metallurgical and Materials Engineering, [S. l.], v. 24, n. 1, p. 27–36, 2018. DOI: 10.30544/344. Disponível em: https://metall-mater-eng.com/index.php/home/article/view/344. Acesso em: 17 jun. 2024.