BABA, Alafara A.; OLUMODEJI, Oyebode O.; ADEKOLA, Folahan A.; LAWA, Misitura; AREMU, Adeniyi S. Quantitative Leaching of a Spent Cell Phone Printed Circuit Board by Hydrochloric acid. Metallurgical and Materials Engineering, [S. l.], v. 20, n. 2, p. 119–130, 2014. DOI: 10.5937/metmateng1402119B. Disponível em: https://metall-mater-eng.com/index.php/home/article/view/162. Acesso em: 11 may. 2026.