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Pal, M.K., Gergely, G., Horváth, D.K. and Gácsi, Z. 2018. Microstructural investigations and mechanical properties of pure lead-free (Sn-3.0Ag-0.5Cu and Sn-4.0Ag-0.5Cu) solder alloy. Metallurgical and Materials Engineering. 24, 1 (Apr. 2018), 27–36. DOI:https://doi.org/10.30544/344.