Displacement Analysis of the MEMS Device
In this study, the displacement analysis of the microelectromechanical system (MEMS) device was performed. The current passing through the microdevice radiates heat energy as it pushes the device to the desired distance through thermal expansion. The amount of expansion varies depending on the current flowing through the device. With the designed model, the amount of current required for the displacement of the MEMS device is determined. In addition, the displacements produced in the microdevice for different metallic materials (silver and gold) and input potentials (0.4 V, 0.8 V, and 1.2 V) were calculated. These types of materials are frequently preferred in MEMS technology due to their high conductivity. Increasing the voltage value as a result of the analysis studies increased the displacement of the materials. When 1.2 V voltage is applied, the highest displacement values for silver and gold are; 6.45 μm, 4.32 μm, respectively. According to the results, the silver material showed a significant displacement compared to gold material.
R. Crescenzi, M. Balucani, N.P. Belfiore: Journal of Micromechanics and Microengineering, 28 (2018) 154-161.
M.K. Mishra, V. Dubey, P.M. Mishra, I. Khan: Journal of Engineering Research and Reports, 5 (2019) 1-24.
R. Lu, M. Li, Y. Yang: Journal of Microelectromechanical Systems, 28 (2019) 209-218.
H. Singh, J. Malhotra: Trans Electr Electron Mater (TEEM), 18 (2017) 16-20.
H. Madinei, H. Khodaparast, M.I. Friswell: Energy, 149 (2018) 990-999.
O. Ulkir: Materials Research Express, 7 (2020) 075015.
S. Nihtianov, A. Luque, Editors: Smart Sensors and MEMS, 2nd edition, Woodhead Publishing, 2018, 28-36.
T. L. Narayana, K. G. Sravani, K. S. Rao: Cogent Engineering, 4 (2017) 1363356.
H. Jiang, M. Huang, Y. Yu, X. Tian, X. Zhao: Sensors, 18 (2018) 94.
M. Pallay, R. N. Miles, S. Towfighian: IEEE Transactions on Industrial Electronics, 67 (2020) 9833 - 9840.
Y. Mita, E. Lebrasseur, Y. Okamoto, F. Marty, R. Setoguchi, K. Yamada: Japanese Journal of Applied Physics, 56 (2017) 06GA03.
H. O. Ali: Transactions of the IMF, 95 (2017) 290-296.
M. R. Solouk, M. H. Shojaeefard, M. Dahmardeh: Mechanical Systems and Signal Processing, 128 (2019) 389-404.
J. Rodriguez, D.D. Gerrard, G. M. Glaze, S. Chandorkar, L. Comenecia, Y. Chen, In: IEEE Sensors, 2017, 17452390.
U. Brand, S. Gao, W. Engl, T. Sulzbach, S. W. Stahl, L. F. Milles, Z. Li: Measurement Science and Technology, 28 (2017) 034010.
M. Vutukuru, J. W. Christopher, C. Pollock, D. J. Bishop, A. K. Swan: Journal of Microelectromechanical Systems, 28 (2019) 550-557.
K. Özsoy, B. Duman, D. İçkale Gültekin: SDU International Journal of Technological Science, 11 (2019) 201-210.
M. Y. Kayacan, K. Özsoy, B. Duman, N. Yilmaz, M. C. Kayacan: Materials and Manufacturing Processes, 34 (2019) 1467-1475.
H. A. Hassen, K. Sofiane, Z. Bilel, Z. Ihsen, K. Sondes: The Pan African Medical Journal, 33 (2019) 107.
Copyright (c) 2020 Ishak Ertugrul
This work is licensed under a Creative Commons Attribution 4.0 International License.
Authors who publish with this journal agree to the following terms:
- Authors retain copyright and grant the journal right of first publication with the work simultaneously licensed under a Creative Commons Attribution License that allows others to share the work with an acknowledgement of the work's authorship and initial publication in this journal.
- Authors are able to enter into separate, additional contractual arrangements for the non-exclusive distribution of the journal's published version of the work (e.g., post it to an institutional repository or publish it in a book), with an acknowledgement of its initial publication in this journal.
- Authors are permitted and encouraged to post their published articles online (e.g., in institutional repositories or on their website, social networks like ResearchGate or Academia), as it can lead to productive exchanges, as well as earlier and greater citation of published work (See The Effect of Open Access).
Except where otherwise noted, the content on this site is licensed under a Creative Commons Attribution 4.0 International License.