Microstructural investigations and mechanical properties of pure lead-free (Sn-3.0Ag-0.5Cu and Sn-4.0Ag-0.5Cu) solder alloy

Authors

  • Manoj Kumar Pal Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc
  • Gréta Gergely Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc
  • Dániel Koncz Horváth Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc
  • Zoltán Gácsi Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc

DOI:

https://doi.org/10.30544/344

Keywords:

Lead-free solder, Sn–Ag–Cu alloys, Microstructure, Mechanical properties.

Abstract

The Lead-free solders (SAC) with low Ag content have been identified as crucial solder to replace the traditional Sn-Pb solder. The main discussion was presented in two major area of microstructural investigation and mechanical properties of SAC305 and SAC405. Composition and microstructure of SAC solder alloys were investigated by an optical microscope and SEM (Scanning Electron Microscopy). Mechanical properties such as tensile tests and hardness test of the lead-free solder alloys have been tested in this research. Different Ag content and constant Cu content of lead-free solder has been considered in this investigation and compare the mechanical properties of SAC305 and SAC405 solders. From this investigation, tensile strength and hardness have been increased with increased of Ag content.

Author Biography

Manoj Kumar Pal, Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc

Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc, Hungary

References

A. A. El-Daly, H. El-Hosainy, T. A. Elmosalami, W. M Desoky: J Alloys Compd, 653 (2015) 402-410.

Crossref

A. A. El-Daly, G. S. Al-Ganainy, A. Fawzy, M. J. Younis: Mater Des, 55 (2014) 837-845.

Crossref

A. A. El-Daly, A. Fawzy, S. F. Mansour, M. J. Younis: Mater Sci and Eng: A, 578 (2013) 62-71.

Crossref

S. M. L. Nai, J. Wei, M. Gupta: Thin Solid Films, 504 (2006) 401-404.

Crossref

P. Liu, P. Yao, J. Liu: J Electron Mater, 37 (2008) 874-879.

Crossref

Y.Tang, G. Y. Li, Y. C. Pan: Mater Des, 55 (2014) 574-582.

Crossref

F. X. Che, W. H. Zhu, Edith SW Poh, X. W. Zhang, X. R. Zhang: J Alloys Compd, 507 (2010) 215-224.

Crossref

W. R. Osório, D. R. Leiva, L. C. Peixoto, L. R. Garcia, A. Garcia: J Alloys Compd, 562 (2013) 194-204.

Crossref

S. Terashima, Y. Kariya, T. Hosoi, M. Tanaka: J Electron Mater, 32 (2003) 1527-1533.

Crossref

T. T. Nguyen, D. Yu, S. B. Park: J Electron Mater, 40 (2011) 1409-1415.

Crossref

A. E. Hammad, A. M. El-Taher: J Electron Mater, 43 (2014) 4146-4157.

Crossref

M. Amagai, Y. Toyoda, T. Tajima, In: Proceedings: In Electronic Components and Technology Conference, 2003, p. 317-322.

W. H. Zhu, Luhua Xu, John HL Pang, X. R. Zhang, Edith Poh, Y. F. Sun, Anthony YS Sun, C. K. Wang, H. B. Tan: Drop reliability study of PBGA assemblies with SAC305, SAC105 and SAC105-Ni solder ball on Cu-OSP and ENIG surface finish, In Electronic Components and Technology Conference, 2008. ECTC 2008. 58th, pp. 1667-1672. IEEE, 2008.

G.R. Mettam, L.B. Adams, In: Proceedings ISOMAT '86. Eds.: Tamura, I., Maki, T. Tokyo, the Iron and Steel Inst. of Japan 1986, p. 665.

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Published

2018-04-02

How to Cite

Pal, Manoj Kumar, Gréta Gergely, Dániel Koncz Horváth, and Zoltán Gácsi. 2018. “Microstructural Investigations and Mechanical Properties of Pure Lead-Free (Sn-3.0Ag-0.5Cu and Sn-4.0Ag-0.5Cu) Solder Alloy”. Metallurgical and Materials Engineering 24 (1):27-36. https://doi.org/10.30544/344.

Issue

Section

Technical papers