The effect of silver addition on microstructure and thermal properties of the Cu-10%Al-8%Mn shape memory alloy
DOI:
https://doi.org/10.30544/321Keywords:
Shape memory alloy, Cu-Al-Mn-Ag alloy, Microstructure, Martensitic transformationAbstract
The influence of Ag addition on microstructure and thermal properties of the Cu-10%Al-8%Mn alloy was investigated in this work. Two alloys with designed compositions Cu-10%Al-8%Mn and Cu-10%Al-8%Mn-4%Ag (in wt.%) were prepared by induction melting of pure metals. Microstructures of the prepared samples were investigated in the as-cast state, after homogenization annealing and after quenching.
The effects of different methods of heat treatment on the microstructure and transformation temperatures of the investigated Cu-10%Al-8%Mn and Cu-10%Al-8%Mn-4%Ag alloys were investigated using SEM-EDS and DSC techniques.
It was determined that after induction melting microstructure of the both investigated alloys are primarily composed of martensite and a small amount of α-phase precipitates.
Fully martensitic structure in both investigated alloys was obtained after direct quenching from the 850 °C into the ice water. Based on the DSC cooling curves it was determined that two-step martensite transformation for the both investigated alloys occur in the temperature interval from about 30 to -40 °C.
References
Z.Wang, X. Zu, Y. Fu: Int J Smart Nano Mater, 2 (3) (2011) 101-119. LINK
R. Dasgupta: J Mater Res, 29 (16) (2014) 1681-1698. LINK
M. Blanco, J.T.C. Barragan, N. Barelli, R.D. Noce, C.S. Fugivara, J. Fernández, A. V. Benedetti: Electrochim Acta, 107 (2013) 238- 247.
M. Ahlers: Prog Mater Sci, 30 (1987)135-186. LINK
Y. Sutou, T. Omori, R. Kainuma and K. Ishida: Mater Sci Technol, 24 (8) (2008) 896-901 LINK
C. Aksu Canbay, Z. KaragozGenc, M. Sekerci: Appl Phys A,115 (2014) 371-377. LINK
C. AksuCanbay, Z. Karagoz: Appl Phys A, 113 (2013) 19-25. LINK
N. Saunders, A.P. Miodownik, CALPHAD (A Comprehensive Guide), Elsevier, London, 1998.
H. L. Lukas, S. G. Fries, B. Sundman, Computational Thermodynamics, Cambridge University Press, Cambridge, UK, 2007.
J. Miettinen. Calphad, 27 (1) (2003) 103-114. LINK
U.S. Mallik, V. Sampath: J Alloys Compd, 459 (2008) 142-147.
I. Ivanic, S. Kozuh, M. Bizjak, B. Kosec, T. Holjevac Grguric, M. Gojic, Influence of annealing at 900 °C on microstructure of Cu-Al-Mn shape memory ribbons, Etikum 2016, Scientific conference with international participation, Novi Sad, Serbia, June 23-25, 2016, pp. 1-4.
W. Cao, S.L. Chen, F. Zhang, K. Wu, Y. Yang, Y. A. Chang, R. Schmid-Fetzer, W. A. Oates: Calphad, 33(2009) 328-342. LINK
U. Sari, I. Aksoy: J Alloys Compd, 417 (2006) 138-142. LINK
G. Lojen, M. Gojić, I. Anžel: J Alloys Compd, 580 (15) (2013) 497-505. LINK
R. Dasgupta, A. K. Jain, P. Kumar, S. Hussein, A. Pandey: J Mater Res Technol, 3 (3) (2014) 264-273. LINK
R. Gastien, C. E. Corbellani, M. Sade, F. C. Lovey. Acta Mater, 53 (2005) 1685-1691. LINK
S. Kustov,J. Pons, E. Cesari, J. Van Humbeeck: Acta Mater, 52 (2004) 4547-4559 LINK
T. Suzuki, R. Kojima, Y. Fujii, A. Nagasawa: Acta Metall, 37 (1) (1989) 163-168. LINK
Downloads
How to Cite
Issue
Section
License
Authors who publish with this journal agree to the following terms:
- Authors retain copyright and grant the journal right of first publication with the work simultaneously licensed under a Creative Commons Attribution License that allows others to share the work with an acknowledgment of the work's authorship and initial publication in this journal.
- Authors are able to enter into separate, additional contractual arrangements for the non-exclusive distribution of the journal's published version of the work (e.g., post it to an institutional repository or publish it in a book), with an acknowledgment of its initial publication in this journal.
- Authors are permitted and encouraged to post their published articles online (e.g., in institutional repositories or on their website, social networks like ResearchGate or Academia), as it can lead to productive exchanges, as well as earlier and greater citation of published work (See The Effect of Open Access).
Except where otherwise noted, the content on this site is licensed under a Creative Commons Attribution 4.0 International License.