A preliminary investigation on microstructure and mechanical properties of dissimilar Al to Cu friction stir welds prepared using silver interlayer
DOI:
https://doi.org/10.63278/mme.v24i1.294Keywords:
Friction stir welding (FSW), Al to Cu welds, silver interlayer.Abstract
Due to its solid-state nature, friction stir welding (FSW) process can be considered a better alternative for dissimilar welding metals. However, like fusion welding techniques, in friction stir welding growth of thick layers of brittle intermetallics - Cu9Al4 and CuAl2 is a significant issue. One solution to this problem is the use of the suitable interlayer material. Use of interlayer material modifies the joint microstructure with the replacement of thick, brittle intermetallics by more ductile intermetallics in a thin layer or particle form. The present study is a preliminary investigation about joining of AA6082-O to pure copper joints with and without silver (Ag) wire interlayer. Friction stir welded joints were characterized regarding optical microscopy, X-Ray Diffraction (XRD) analysis, microhardness measurement, tensile testing and Scanning Electron Microscopy (SEM) based fractography. The Al-Cu weld prepared using silver interlayer was stronger than without it. The higher strength of the weld with silver interlayer is attributed to the formation of a composite type of structure with intercalation of more ductile Ag2Al intermetallics along with dispersion of Ag particles in stir zone.
References
C. H. Muralimohan, S. Haribabu, Y. H. Reddy, V. Muthupandi, K. Sivaprasad: Procedia Mater Sci, 5 (2014) 1107-1113.
B. Mvola, P. Kah, J. Martikainen: Int J Mech Mater Eng, 9 (2014) 1-9.
N. Kumar, W. Yuan, R. S. Mishra, Friction stir welding of dissimilar alloys and materials, 1st Ed., Butterworth-Heinemann, Oxford, UK, 2015, 85.
S Imaizumi: Weld Int, 10 (1996) 593-604.
W. M. Thomas, E. D. Nicholas, J. C. Needham, M. G. Murch, P. Templesmith, C. J. Dawes, G.B. Pat Appl No. 9125978.8, 1991.
Dawes C J & Thomas W M: TWI Bull, 6 (1995) 124.
E.T. Akinlabi: J Mater Eng Perform, 21 (7) (2012) 1514-1519.
P.B. Prangnell and C.P. Heason: Acta Mater, 53 (2005) 3179-3192.
L.E. Murr, Y. Li, R. D. Flores, E. A. Trillo, J. C. McClure: Mater Res Innovations, 2 (1998) 150-163.
I Galvao, C Leitao, A Loureiro, D M Rodrigues: Mater Des, 42 (2012) 259-264.
C.W. Tan, Z.G. Jiang, L.Q. Li, Y.B. Chen, X.Y. Chen: Mater and Des, 51 (2013) 466-473.
P K Sahu, S. Pal, S K Pal, R. Jain: J Mater Process Technol, 235 (2016) 55-67.
J Ouyang, E Yarrapareddy, R Kovacevic: J Mater Process Technol, 172 (2006) 110-122.
M. N. Avettand-Fenoel, R. Taillard, G. Ji, D. Goran: Metall Mater Trans A, 43 (2012) 4655-4666.
I. Galvao, A. Loureiro, D. Verdera, D. Gesto, D. M. Rodrigues: Metall Mater Trans A, 43A (2012) 5096-5105.
J. Kandasamy, M. M. Hussain, S. Rajesham: Mater Manuf Processes, 27 (2012) 1429-1436.
C. Weisman, W H Kearna (Editors), AWS Welding Handbook Vol.4, Metals & their Weldability, 7th Ed., American Welding Society, Michigan, 1982, 536.
C. Maldonado, A. M. Flores, L. B. Gomez, A. Ruiz, I. Alfonso, J. A. Ascencio: Rev Me Fis, S 55 (1) (2009) 130-134.
Y. Wang, G. Luo, L. Li, Q. Shen, L. Zhang: J Mater Sci, 49 (2014) 7298-7308.
M H M Kouters, G H M Gubbels, O D. S. Ferreira: Microelectron Reliab, 53 (2013) 1068-1075.
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