Transient liquid phase diffusion bonding of stainless steel 304 using copper and aluminium filler interlayers
Keywords: Stainless steel, Transient liquid phase diffusion bonding, Characterization.
AbstractStainless steel 304 was successfully joined by transient liquid phase diffusion bonding. The bonding process was carried out in a vacuum furnace at various temperatures for various diffusion times, using pure copper interlayer. The joints were studied with optical and scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and corrosion test. The diffusion of the main elements from the interlayers into the base metal at the bonding temperatures was the main controlling factor pertaining to the microstractural evolution of the joint interface. In order to determine the corrosion resistance of the joints, Tafel test was conducted in 3.5% NaCl solution. The presence of eutectoid γFe+ eutectic Cu + Cr was detected at the interface of the joints bonded with copper. The joints related to stainless steel-copper developed crevice corrosion due to galvanic couple between the stainless steel and copper. Pitting was also occurred due to intergranular corrosion on the copper surface.
Articles - archived
Copyright (c) 2017 M. Mazar Atabaki, J. Noor Watib, J. Bte Idris
This work is licensed under a Creative Commons Attribution 4.0 International License.
Authors who publish with this journal agree to the following terms:
- Authors retain copyright and grant the journal right of first publication with the work simultaneously licensed under a Creative Commons Attribution License that allows others to share the work with an acknowledgement of the work's authorship and initial publication in this journal.
- Authors are able to enter into separate, additional contractual arrangements for the non-exclusive distribution of the journal's published version of the work (e.g., post it to an institutional repository or publish it in a book), with an acknowledgement of its initial publication in this journal.
- Authors are permitted and encouraged to post their published articles online (e.g., in institutional repositories or on their website, social networks like ResearchGate or Academia), as it can lead to productive exchanges, as well as earlier and greater citation of published work (See The Effect of Open Access).
Except where otherwise noted, the content on this site is licensed under a Creative Commons Attribution 4.0 International License.