Transient liquid phase diffusion bonding of stainless steel 304 using copper and aluminium filler interlayers

  • M. Mazar Atabaki
  • J. Noor Watib
  • J. Bte Idris
Keywords: Stainless steel, Transient liquid phase diffusion bonding, Characterization.

Abstract

Stainless steel 304 was successfully joined by transient liquid phase diffusion bonding. The bonding process was carried out in a vacuum furnace at various temperatures for various diffusion times, using pure copper interlayer. The joints were studied with optical and scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and corrosion test. The diffusion of the main elements from the interlayers into the base metal at the bonding temperatures was the main controlling factor pertaining to the microstractural evolution of the joint interface. In order to determine the corrosion resistance of the joints, Tafel test was conducted in 3.5% NaCl solution. The presence of eutectoid γFe+ eutectic Cu + Cr was detected at the interface of the joints bonded with copper. The joints related to stainless steel-copper developed crevice corrosion due to galvanic couple between the stainless steel and copper. Pitting was also occurred due to intergranular corrosion on the copper surface.
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